semiconductor technical data 1 rev 6 ? motorola, inc. 1995 10/95 highperformance silicongate cmos the m c54/74hc138 a i s i dentica l i n p inou t t o t h e l s138 . t h e d evice inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. the hc138a decodes a threebit address to oneofeight activelow outputs. this device features three chip select inputs, two activelow and one activehigh to facilitate the demultiplexing, cascading, and chipselect- ing f unctions . t h e d emultiplexin g f unctio n i s a ccomplishe d b y u sin g t he address inputs to select the desired device output; one of the chip selects is used as a data input while the other chip selects are held in their active states. ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos and ttl ? operating voltage range: 2.0 to 6.0 v ? low input current: 1.0 m a ? high noise immunity characteristic of cmos devices ? in compliance with the requirements defined by jedec standard no. 7a ? chip complexity: 100 fets or 29 equivalent gates logic diagram 7 y6 y5 y4 y3 y2 y1 y0 y7 9 10 11 12 13 14 15 3 2 1 cs1 cs2 a0 a1 a2 activelow outputs address inputs cs3 chip select inputs 5 4 6 pin 16 = v cc pin 8 = gnd inputs outputs cs1cs2 cs3 a2 a1 a0 y0 y1 y2 y3 y4 y5 y6 y7 x x h x x x h h h h h h h h x h x x x x h h h h h h h h l x x x x x h h h h h h h h h l l l l l l h h h h h h h h l l l l h h l h h h h h h h l l l h l h h l h h h h h h l l l h h h h h l h h h h h l l h l l h h h h l h h h h l l h l h h h h h h l h h h l l h h l h h h h h h l h h l l h h h h h h h h h h l function table h = high level (steady state); l = low level (steady state); x = don't care
pin assignment 13 14 15 16 9 10 11 12 5 4 3 2 1 8 7 6 a0 cs2 a2 a1 y7 cs1 cs3 gnd y3 y2 y1 y0 v cc y5 y4 y6 d suffix soic package case 751b05 n suffix plastic package case 64808 ordering information mc54hcxxxaj mc74hcxxxan mc74hcxxxad mc74hcxxxadt ceramic plastic soic tssop 1 16 1 16 1 16 dt suffix tssop package case 948f01 j suffix ceramic package case 62010 1 16
mc54/74hc138a motorola highspeed cmos logic data dl129 e rev 6 2 ??????????????????????? ??????????????????????? ??????????????????????? ??????????????????????? maximum ratings* ??? ??? ??? ??? symbol ?????????????? ?????????????? ?????????????? ?????????????? parameter ?????? ?????? ?????? ?????? value ??? ??? ??? ??? unit ??? ??? ??? ??? v cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to + 7.0 ??? ??? ??? ??? v ??? ??? ??? ??? v in ?????????????? ?????????????? ?????????????? ?????????????? dc input voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to v cc + 0.5 ??? ??? ??? ??? v ??? ??? ??? ??? v out ?????????????? ?????????????? ?????????????? ?????????????? dc output voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to v cc + 0.5 ??? ??? ??? ??? v ??? ??? ??? ??? i in ?????????????? ?????????????? ?????????????? ?????????????? dc input current, per pin ?????? ?????? ?????? ?????? 20 ??? ??? ??? ??? ma ??? ??? ??? ??? i out ?????????????? ?????????????? ?????????????? ?????????????? dc output current, per pin ?????? ?????? ?????? ?????? 25 ??? ??? ??? ??? ma ??? ??? ??? ??? i cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply current, v cc and gnd pins ?????? ?????? ?????? ?????? 50 ??? ??? ??? ??? ma ??? ??? ??? ??? ??? p d ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? power dissipation in still air, plastic or ceramic dip2 soic package2 tssop package2 ?????? ?????? ?????? ?????? ?????? 750 500 450 ??? ??? ??? ??? ??? mw ??? ??? ??? ??? t stg ?????????????? ?????????????? ?????????????? ?????????????? storage temperature ?????? ?????? ?????? ?????? 65 to + 150 ??? ??? ??? ??? c ??? ??? ??? ??? ??? ??? t l ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? lead t emperature, 1 mm from case for 10 seconds (plastic dip, soic or tssop package) (ceramic dip) ?????? ?????? ?????? ?????? ?????? ?????? 260 300 ??? ??? ??? ??? ??? ??? c * maximum ratings are those values beyond which damage to the device may occur . functional operation should be restricted to the recommended operating conditions. 2derating e plastic dip: 10 mw/ c from 65 to 125 c ceramic dip: 10 mw/ c from 100 to 125 c soic package: 7 mw/ c from 65 to 125 c tssop package: 6.1 .w/ c from 65 to 125 c for high frequency or heavy load considerations, see chapter 2 of the motorola highspeed cmos data book (dl129/d). recommended operating conditions ???? ???? ???? ???? symbol ?????????????? ?????????????? ?????????????? ?????????????? parameter ??? ??? ??? ??? min ??? ??? ??? ??? max ??? ??? ??? ??? unit ???? ???? ???? ???? v cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply voltage (referenced to gnd) ??? ??? ??? ??? 2.0 ??? ??? ??? ??? 6.0 ??? ??? ??? ??? v ???? ???? ???? ???? v in , v out ?????????????? ?????????????? ?????????????? ?????????????? dc input voltage, output voltage (referenced to gnd) ??? ??? ??? ??? 0 ??? ??? ??? ??? v cc ??? ??? ??? ??? v ???? ???? ???? ???? t a ?????????????? ?????????????? ?????????????? ?????????????? operating temperature, all package types ??? ??? ??? ??? 55 ??? ??? ??? ??? + 125 ??? ??? ??? ??? c ???? ???? ???? ???? ???? t r , t f ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? input rise and fall time v cc = 2.0 v (figure 2) v cc = 4.5 v v cc = 6.0 v ??? ??? ??? ??? ??? 0 0 0 ??? ??? ??? ??? ??? 1000 500 400 ??? ??? ??? ??? ??? ns dc electrical characteristics (voltages referenced to gnd) ???? ???? ???? ???? symbol ????????? ????????? ????????? ????????? parameter ????????? ????????? ????????? ????????? test conditions ???? ???? ???? ???? v cc v ????????? ????????? ????????? ????????? guaranteed limit ??? ??? ??? ??? unit ???? ???? ???? ???? symbol ????????? ????????? ????????? ????????? parameter ????????? ????????? ????????? ????????? test conditions ???? ???? ???? ???? v cc v ??? ??? ??? ??? 55 c to 25 c ???? ???? ???? ???? 85 c ???? ???? ???? ???? 125 c ??? ??? ??? ??? unit ???? ???? ???? ???? ???? ???? v ih ????????? ????????? ????????? ????????? ????????? ????????? minimum highlevel input voltage ????????? ????????? ????????? ????????? ????????? ????????? v out = 0.1 v or v cc 0.1 v |i out | 20 m a ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 1.5 2.1 3.15 4.2 ???? ???? ???? ???? ???? ???? 1.5 2.1 3.15 4.2 ???? ???? ???? ???? ???? ???? 1.5 2.1 3.15 4.2 ??? ??? ??? ??? ??? ??? v ???? ???? ???? ???? ???? ???? v il ????????? ????????? ????????? ????????? ????????? ????????? maximum lowlevel input voltage ????????? ????????? ????????? ????????? ????????? ????????? v out = 0.1 v or v cc 0.1 v |i out | 20 m a ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 0.5 0.9 1.35 1.8 ???? ???? ???? ???? ???? ???? 0.5 0.9 1.35 1.8 ???? ???? ???? ???? ???? ???? 0.5 0.9 1.35 1.8 ??? ??? ??? ??? ??? ??? v ???? ???? ???? ???? ???? v oh ????????? ????????? ????????? ????????? ????????? minimum highlevel output voltage ????????? ????????? ????????? ????????? ????????? v in = v ih or v il |i out | 20 m a ???? ???? ???? ???? ???? 2.0 4.5 6.0 ??? ??? ??? ??? ??? 1.9 4.4 5.9 ???? ???? ???? ???? ???? 1.9 4.4 5.9 ???? ???? ???? ???? ???? 1.9 4.4 5.9 ??? ??? ??? ??? ??? v ???? ???? ???? ???? ???? ???? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? v in = v ih or v il |i out | 2.4 ma |i out | 4.0 ma |i out | 5.2 ma ???? ???? ???? ???? ???? ???? 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 2.48 3.98 5.48 ???? ???? ???? ???? ???? ???? 2.34 3.84 5.34 ???? ???? ???? ???? ???? ???? 2.20 3.70 5.20 ??? ??? ??? ??? ??? ??? this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however , precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance cir - cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc54/74hc138a highspeed cmos logic data dl129 e rev 6 3 motorola dc electrical characteristics (voltages referenced to gnd) ??? ??? ??? ??? unit ????????? ????????? ????????? ????????? guaranteed limit ???? ???? ???? ???? v cc v ????????? ????????? ????????? ????????? test conditions ????????? ????????? ????????? ????????? parameter ???? ???? ???? ???? symbol ??? ??? ??? ??? ??? unit ???? ???? ???? ???? ???? 125 c ???? ???? ???? ???? ???? 85 c ??? ??? ??? ??? ??? 55 c to 25 c ???? ???? ???? ???? ???? v cc v ????????? ????????? ????????? ????????? ????????? test conditions ????????? ????????? ????????? ????????? ????????? parameter ???? ???? ???? ???? ???? symbol ???? ???? ???? ???? ???? v ol ????????? ????????? ????????? ????????? ????????? maximum lowlevel output voltage ????????? ????????? ????????? ????????? ????????? v in = v ih or v il |i out | 20 m a ???? ???? ???? ???? ???? 2.0 4.5 6.0 ??? ??? ??? ??? ??? 0.1 0.1 0.1 ???? ???? ???? ???? ???? 0.1 0.1 0.1 ???? ???? ???? ???? ???? 0.1 0.1 0.1 ??? ??? ??? ??? ??? v ???? ???? ???? ???? ???? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? ????????? v in = v ih or v il |i out | 2.4 ma |i out | 4.0 ma |i out | 5.2 ma ???? ???? ???? ???? ???? 3.0 4.5 6.0 ??? ??? ??? ??? ??? 0.26 0.26 0.26 ???? ???? ???? ???? ???? 0.33 0.33 0.33 ???? ???? ???? ???? ???? 0.40 0.40 0.40 ??? ??? ??? ??? ??? ???? ???? ???? ???? i in ????????? ????????? ????????? ????????? maximum input leakage current ????????? ????????? ????????? ????????? v in = v cc or gnd ???? ???? ???? ???? 6.0 ??? ??? ??? ??? 0.1 ???? ???? ???? ???? 1.0 ???? ???? ???? ???? 1.0 ??? ??? ??? ??? m a ???? ???? ???? ???? ???? i cc ????????? ????????? ????????? ????????? ????????? maximum quiescent supply current (per package) ????????? ????????? ????????? ????????? ????????? v in = v cc or gnd i out = 0 m a ???? ???? ???? ???? ???? 6.0 ??? ??? ??? ??? ??? 4 ???? ???? ???? ???? ???? 40 ???? ???? ???? ???? ???? 160 ??? ??? ??? ??? ??? m a note: information on typical parametric values can be found in chapter 2 of the motorola highspeed cmos data book (dl129/d). ac electrical characteristics (c l = 50 pf, input t r = t f = 6.0 ns) ???? ???? ???? ???? symbol ????????????????? ????????????????? ????????????????? ????????????????? parameter ???? ???? ???? ???? v cc v ????????? ????????? ????????? ????????? guaranteed limit ??? ??? ??? ??? unit ???? ???? ???? ???? ???? symbol ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? parameter ???? ???? ???? ???? ???? v cc v ??? ??? ??? ??? ??? 55 c to 25 c ???? ???? ???? ???? ???? 85 c ???? ???? ???? ???? ???? 125 c ??? ??? ??? ??? ??? unit ???? ???? ???? ???? ???? ???? t plh , t phl ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? maximum propagation delay, input a to output y (figures 1 and 4) ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 135 90 27 23 ???? ???? ???? ???? ???? ???? 170 125 34 29 ???? ???? ???? ???? ???? ???? 205 165 41 35 ??? ??? ??? ??? ??? ??? ns ???? ???? ???? ???? ???? ???? t plh , t phl ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? maximum propagation delay, cs1 to output y (figures 2 and 4) ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 110 85 22 19 ???? ???? ???? ???? ???? ???? 140 100 28 24 ???? ???? ???? ???? ???? ???? 165 125 33 28 ??? ??? ??? ??? ??? ??? ns ???? ???? ???? ???? ???? ???? t plh , t phl ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? maximum propagation delay, cs2 or cs3 to output y (figures 3 and 4) ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 120 90 24 20 ???? ???? ???? ???? ???? ???? 150 120 30 26 ???? ???? ???? ???? ???? ???? 180 150 36 31 ??? ??? ??? ??? ??? ??? ns ???? ???? ???? ???? ???? ???? t tlh , t thl ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? ????????????????? maximum output transition time, any output (figures 2 and 4) ???? ???? ???? ???? ???? ???? 2.0 3.0 4.5 6.0 ??? ??? ??? ??? ??? ??? 75 30 15 13 ???? ???? ???? ???? ???? ???? 95 40 19 16 ???? ???? ???? ???? ???? ???? 110 55 22 19 ??? ??? ??? ??? ??? ??? ns ???? ???? ???? ???? c in ????????????????? ????????????????? ????????????????? ????????????????? maximum input capacitance ???? ???? ???? ???? e ??? ??? ??? ??? 10 ???? ???? ???? ???? 10 ???? ???? ???? ???? 10 ??? ??? ??? ??? pf note: for propagation delays with loads other than 50 pf, and information on typical parametric values, see chapte r 2 o f the motorola high speed cmos data book (dl129/d). c pd power dissipation capacitance (per package)* typical @ 25 c, v cc = 5.0 v pf c pd power dissipation capacitance (per package)* 55 pf * used to determine the noload dynamic power consumption: p d = c pd v cc 2 f + i cc v cc . for load considerations, see chapter 2 of the motorola highspeed cmos data book (dl129/d).
mc54/74hc138a motorola highspeed cmos logic data dl129 e rev 6 4 figure 1. 50% t phl t plh v cc gnd figure 2. valid valid output y 50% t f t r v cc gnd t plh t tlh 90% 50% 10% output y input cs1 t phl 90% 50% 10% t thl input a switching waveforms t thl t tlh v cc gnd t r t phl t plh output y input cs2, cs3 90% 50% 10% 90% 50% 10% figure 3. t f * includes all probe and jig capacitance figure 4. test circuit c l * test point device under test output pin descriptions address inputs a0, a1, a2 (pins 1, 2, 3) address inputs. these inputs, when the chip is selected, determine which of the eight outputs is activelow. control inputs cs1, cs2, cs3 (pins 6, 4, 5) chip select inputs. for cs1 at a high level and cs2, cs3 at a low level, the chip is selected and the outputs follow the address inputs. for any other combination of cs1, cs2, and cs3, the outputs are at a logic high. outputs y0 y7 (pins 15, 14, 13, 12, 11, 10, 9, 7) activelow decoded outputs. these outputs assume a low level when addressed and the chip is selected. these out - puts r emai n h ig h w he n n o t a ddresse d o r t h e c hi p i s n ot selected.
mc54/74hc138a highspeed cmos logic data dl129 e rev 6 5 motorola a0 a1 a2 cs3 cs2 cs1 1 2 3 4 5 6 15 14 13 12 11 10 9 7 y1 y2 y3 y4 y5 y6 y7 y0 expanded logic diagram
mc54/74hc138a motorola highspeed cmos logic data dl129 e rev 6 6 outline dimensions j suffix ceramic package case 62010 issue v n suffix plastic package case 64808 issue r 19.05 6.10 e 0.39 1.40 0.21 3.18 19.93 7.49 5.08 0.50 1.65 0.38 4.31 0 0.51 15 1.01 1.27 bsc 2.54 bsc 7.62 bsc min min max max inches millimeters dim 0.750 0.240 e 0.015 0.055 0.008 0.125 0.785 0.295 0.200 0.020 0.065 0.015 0.170 0.050 bsc 0.100 bsc 0.300 bsc a b c d e f g j k l m n 0 0.020 15 0.040 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dim f may narrow to 0.76 (0.030) where the lead enters the ceramic body. 1 8 9 16 a b c k n g e f d 16 pl t seating plane m l j 16 pl 0.25 (0.010) t a m s 0.25 (0.010) t b m s min min max max inches millimeters dim a b c d f g h j k l m s 18.80 6.35 3.69 0.39 1.02 0.21 2.80 7.50 0 0.51 19.55 6.85 4.44 0.53 1.77 0.38 3.30 7.74 10 1.01 0.740 0.250 0.145 0.015 0.040 0.008 0.110 0.295 0 0.020 0.770 0.270 0.175 0.021 0.070 0.015 0.130 0.305 10 0.040 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. 2.54 bsc 1.27 bsc 0.100 bsc 0.050 bsc a b 1 8 9 16 f h g d 16 pl s c t seating plane k j m l t a 0.25 (0.010) m m 0.25 (0.010) t b a m s s min min max max millimeters inches dim a b c d f g j k m p r 9.80 3.80 1.35 0.35 0.40 0.19 0.10 0 5.80 0.25 10.00 4.00 1.75 0.49 1.25 0.25 0.25 7 6.20 0.50 0.386 0.150 0.054 0.014 0.016 0.008 0.004 0 0.229 0.010 0.393 0.157 0.068 0.019 0.049 0.009 0.009 7 0.244 0.019 1.27 bsc 0.050 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 1 8 9 16 a b d 16 pl k c g t seating plane r x 45 m j f p 8 pl 0.25 (0.010) b m m d suffix plastic soic package case 751b05 issue j
mc54/74hc138a highspeed cmos logic data dl129 e rev 6 7 motorola outline dimensions dt suffix plastic tssop package case 948f01 issue o ?? ?? ?? ?? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 16x ref k n n how to reach us: usa/europe : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, toshikatsu otsuki, p.o. box 20912; phoenix, arizona 85036. 18004412447 6f seibubutsuryucenter, 3142 tatsumi kotoku, tokyo 135, japan. 0335218315 mfax : rmf ax0@email.sps.mot.com touchtone (602) 2446609 hong kong : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, internet : http://designnet.com 51 ting kok road, tai po, n.t., hong kong. 85226629298 motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation consequential or incidental damages. at ypicalo parameters can and do vary in dif ferent applications. all operating parameters, including at ypicalso must be validated for each customer application by customer ' s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur . should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/af firmative action employer . mc54/74hc138a/d
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